IP Library › Assignment 024400/0204
Patent Assignment
Reel/Frame 024400/0204

Assignment of Assignor's Interest

Recorded: 2010-05-18 Pages: 2
Assignors
LIN, YUNG-CHI
Executed: 2010-04-16
LIN, JING-CHENG
Executed: 2010-04-16
YU, CHEN-HUA
Executed: 2010-04-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property (1)
Package Systems Having Interposers with Interconnection Structures
Patent: 8,866,301 →
Application: 12/781,960 →
Publication: US 2011/0285005
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →