Patent Assignment
Reel/Frame 024418/0389
Assignment of Assignor's Interest
Recorded: 2010-05-20
Pages: 2
Assignors
SHEN, WEN-WEI
Executed: 2010-05-12
SHIH, YING-CHING
Executed: 2010-05-12
CHEN, CHEN-SHIEN
Executed: 2010-05-12
CHEN, MING-FA
Executed: 2010-05-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Substrate Interconnections having Different Sizes