Patent Assignment
Reel/Frame 024444/0774
Assignment of Assignor's Interest
Recorded: 2010-05-26
Pages: 4
Assignors
CHANG, HUNG-PIN
Executed: 2010-03-22
CHIU, CHIEN-MING
Executed: 2010-03-22
WU, TSANG-JIUH
Executed: 2010-03-22
SHUE, SHAU-LIN
Executed: 2010-03-22
YU, CHEN-HUA
Executed: 2010-03-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Multi-Layer Interconnect Structure for Stacked Dies