Patent Assignment
Reel/Frame 024451/0143
Assignment of Assignor's Interest
Recorded: 2010-05-27
Pages: 3
Assignors
LIM, HWAN-SIK
Executed: 2010-05-10
KANG, SUNWON
Executed: 2010-05-10
LEE, JONGHO
Executed: 2010-05-10
Assignee
SAMSUNG ELECTRONICS CO., LTD
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method for Fabricating the Same