Patent Assignment
Reel/Frame 024454/0289
Assignment of Assignor's Interest
Recorded: 2010-05-28
Pages: 5
Assignors
HUANG, CHENG-LIN
Executed: 2010-05-21
YANG, JIING-FENG
Executed: 2010-05-21
CHEN, CHII-PING
Executed: 2010-05-21
CHEN, DIAN-HAU
Executed: 2010-05-21
MII, YUH-JIER
Executed: 2010-05-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Partial Air Gap Formation for Providing Interconnect Isolation in Integrated Circuits