Patent Assignment
Reel/Frame 024467/0649
Assignment of Assignor's Interest
Recorded: 2010-06-01
Pages: 7
Assignors
KRIMAN, MOSHE
Executed: 2010-04-12
AVSIAN, OSHER
Executed: 2010-04-12
HABA, BELGACEM
Executed: 2010-04-22
HUMPSTON, GILES
Executed: 2010-03-22
BURSHTYN, DMITRI
Executed: 2010-05-26
Assignee
TESSERA TECHNOLOGIES HUNGARY KFT.
C/O TMF HUNGARY LTD., WESSELENYI U. 16, BUDAPEST, 1077, HUNGARY
Covered Property
(1)
Stacked Microelectronic Assemblies Having Vias Extending Through Bond Pads
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 17, 2010
From: TESSERA TECHNOLOGIES HUNGARY HOLDING LIMITED LIABILITY COMPANY
To: TESSERA TECHNOLOGIES IRELAND LIMITED
Reel/Frame 025592/0734 →
Assignment of Assignor's Interest
Jun 29, 2011
From: TESSERA TECHNOLOGIES IRELAND LIMITED
To: TESSERA, INC.
Reel/Frame 026545/0288 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →