IP Library › Assignment 025592/0734
Patent Assignment
Reel/Frame 025592/0734

Assignment of Assignor's Interest

Recorded: 2010-12-17 Received: 2010-12-17 Pages: 26
Assignor
Assignee
TESSERA TECHNOLOGIES IRELAND LIMITED
CLIONA, BUILDING ONE, PARKMORE EAST BUSINESS PARK, BALLYBRIT, GALWAY, IEX, IRELAND
Covered Properties (21)
Stacked Microelectronic Assemblies Having Vias Extending Through Bond Pads
Application: 12/723,039 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 11/894,473 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 11/891,867 →
Wafer-Level Fabrication of Lidded Chips with Electrodeposited Dielectric Coating
Application: 11/789,694 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 11/699,852 →
Wafer level packaging to lidded chips
Application: 11/655,739 →
Wafer Level Chip Packaging
Application: 11/655,777 →
Wafer-Level Fabrication of Lidded Chips with Electrodeposited Dielectric Coating
Application: 11/590,616 →
Integrated Circuit Device
Application: 11/588,439 →
Chip Packages with Covers
Application: 11/588,489 →
Integrated circuit device
Application: 11/588,490 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 11/125,624 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 10/884,058 →
Packaged Integrated Circuits and Methods of Producing Thereof
Application: 10/451,564 →
System and Method for Providing Random Access to a Multimedia Object Over a Network
Application: 10/646,933 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 10/462,576 →
Integrated Circuit Device
Application: 10/385,555 →
Methods for Producing Packaged Integrated Circuit Devices and Packaged Integrated Circuit Devices Produced Thereby
Application: 10/277,498 →
Medical Puncturing Device
Application: 10/017,789 →
Methods for Producing Packaged Integrated Circuit Devices & Packaged Integrated Circuit Devices Produced Thereby
Application: 09/922,770 →
Packaged Integrated Circuits and Methods of Producing Thereof
Application: 09/758,906 →