Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
View Patent ↗A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material exposed at least one of the front and rear surfaces. At least some of the conductive features are insulated from the exposed semiconductive or conductive material. By electrodeposition, an insulative layer is formed to overlie the at least one of exposed semiconductive material or conductive material. Subsequently, a plurality of conductive contacts and a plurality of conductive traces are formed overlying the electrodeposited insulative layer, the conductive traces connecting the conductive features to the conductive contacts. The unit can be incorporated in a camera module having an optical element in registration with an imaging area of the semiconductor element.
1. A method of fabricating a microelectronic unit, the method comprising:
assembling a front face of a semiconductor chip with a cover element through a standoff structure disposed along the perimeter of the front face of the semiconductor chip to form a unit, the semiconductor chip including a rear face remote from the front face of the semiconductor chip, the unit having an exterior major surface parallel to the front face of the semiconductor chip and which includes at least a portion of the rear face of the semiconductor chip, the semiconductor chip including a plurality of semiconductor devices, a first insulative layer overlying the front face of the semiconductor chip, and a plurality of conductive features overlying the first insulative layer and being conductively connected to the plurality of semiconductor devices, the semiconductor chip including a plurality of transverse surfaces that extend from the exterior major surface of the unit and which coincide with a plurality of sloped edges of the semiconductor chip that extend from the perimeter of the rear face of the semiconductor chip toward the first insulative layer;
electrodepositing a second insulative layer onto the plurality of sloped edges of the semiconductor chip and at least a portion of the exterior major surface; and
forming a plurality of conductive traces onto the second insulative layer along portions of the plurality of sloped edges of the semiconductor chip and the exterior major surface, the plurality of conductive traces being connected to the end portions of the at least some of the plurality of conductive features.
2. The method as claimed in claim 1 , wherein at least some of the plurality of transverse surfaces coincide with openings extending from the rear face of the semiconductor chip to the first insulative layer, and the second insulative layer is electrodeposited onto the rear face and the openings.
3. The method as claimed in claim 1 , wherein the cover element has an outer surface remote from the front face of the semiconductor chip and the cover element includes a dielectric material exposed at the outer surface.
4. The method as claimed in claim 1 , further comprising:
electrodepositing a third insulative layer onto portions of the plurality of conductive traces; and
forming a plurality of conductive contacts in openings in the third insulative layer overlying the plurality of conductive traces, the plurality of conductive traces conductively connecting the conductive contacts to the conductive features.
5. The method as claimed in claim 1 , wherein at least some of the plurality of conductive features have respective end portions that extend outwardly from the sloped edges of the semiconductor chip.
6. A method of fabricating a microelectronic unit, the method comprising:
assembling a semiconductor element with a cover element to form a unit, the unit having an exterior major surface parallel to a front face of the semiconductor element, the semiconductor element including a plurality of semiconductor devices, a first insulative layer overlying the front face and a plurality of conductive features overlying the first insulative layer and conductively connected to the plurality of semiconductor devices, at least one of the semiconductor element or the cover element including transverse surfaces extending inwardly from the exterior major surface of the unit, wherein the semiconductor element includes a rear face remote from the front face and the exterior major surface of the unit includes at least a portion of the rear face of the semiconductor element;
electrodepositing a second insulative layer overlying the transverse surfaces and at least a portion of the exterior major surface; and
forming a plurality of conductive traces overlying the second insulative layer along portions of the transverse surfaces and the exterior major surface, the plurality of conductive traces being connected to the plurality of conductive features;
wherein the semiconductor element includes a plurality of chips joined together at a plurality of dicing lanes, wherein when the second insulative layer is deposited, at least some of the plurality of conductive features are disposed adjacent to each other across ones of the plurality of dicing lanes and the at least some conductive features are conductively connected to each other by conductive elements extending across the plurality of dicing lanes.
7. The method as claimed in claim 6 , further comprising severing the plurality of chips along the plurality of dicing lanes.
8. A method of fabricating a microelectronic unit, the method comprising:
assembling a semiconductor element with a cover element to form a unit, the unit having an exterior major surface parallel to a front face of the semiconductor element, the semiconductor element including a plurality of semiconductor devices, a first insulative layer overlying the front face and a plurality of conductive features overlying the first insulative layer and conductively connected to the plurality of semiconductor devices, at least one of the semiconductor element or the cover element including transverse surfaces extending inwardly from the exterior major surface of the unit;
electrodepositing a second insulative layer overlying the transverse surfaces and at least a portion of the exterior major surface; and
forming a plurality of conductive traces overlying the second insulative layer along portions of the transverse surfaces and the exterior major surface, the plurality of conductive traces being connected to the plurality of conductive features;
wherein the semiconductor element includes a rear face remote from the front face and the exterior major surface of the unit includes at least a portion of the rear face of the semiconductor element, at least some of the plurality of transverse surfaces coincide with openings extending from the rear surface of the semiconductor element to the first insulative layer, and the second insulative layer is electrodeposited onto the rear face and the openings;
wherein the step of assembling the semiconductor element with the cover element is performed when the semiconductor element has an essentially continuous rear surface and the cover element has an essentially continuous outer surface, the method further comprising forming the plurality of openings by removing semiconductor material from the semiconductor element.
9. The method as claimed in claim 8 , further comprising grinding the semiconductor element from the rear face to reduce the thickness of the semiconductor element prior to forming the plurality of openings.
10. The method as claimed in claim 8 , wherein the plurality of openings are formed by etching the semiconductor element.
11. The method as claimed in claim 10 , wherein the semiconductor element is etched by applying an etchant through openings in a mask layer, the etchant not attacking the first insulative layer during the etching of the semiconductor element.
12. The method as claimed in claim 11 , further comprising extending the plurality of openings through the first insulative layer to expose at least some of the conductive features after the step of electrodepositing the second insulative layer.
13. The method as claimed in claim 12 , wherein the step of forming the plurality of traces includes depositing a metal layer onto the at least some conductive features, and onto the second insulative layer overlying the openings in the semiconductor element and the rear face of the semiconductor element.
14. The method as claimed in claim 13 , wherein the metal layer is deposited by sputtering.
15. The method as claimed in claim 13 , wherein the metal layer is deposited by chemical vapor deposition (“CVD”).
16. The method as claimed in claim 13 , wherein the metal layer is deposited by a step of electroless plating followed by a step of electrolytic plating.
17. The method as claimed in claim 13 , wherein the metal layer is conformally deposited to overlie at least the rear face and walls of the openings, the plurality of conductive traces include a plurality of first metal patterns photolithographically defined from the metal layer, and the step of forming the plurality of conductive traces further includes plating a second metal layer onto the plurality of first metal patterns.
18. The method as claimed in claim 13 , wherein the metal layer is conformally deposited to overlie at least the rear face and walls of the openings, the step of forming the plurality of traces includes photolithographically defining first metal patterns from the metal layer, and plating a second metal layer onto the plurality of first metal patterns.
19. The method as claimed in claim 18 , wherein the metal layer includes aluminum, the second metal layer includes nickel, and the metal layer is deposited by sputtering.
20. The method as claimed in claim 18 , wherein the metal layer includes titanium, the second metal layer includes nickel, and the metal layer is deposited by sputtering.
21. The method as claimed in claim 20 , further comprising plating a third metal layer to overlie the second metal layer, the third metal layer including copper.
22. The method as claimed in claim 13 , further comprising applying a dielectric masking layer to overlie the plurality of conductive traces and rear surface, the masking layer having mask openings aligned with at least some of the plurality of conductive traces, and forming a plurality of external contacts within the mask openings, the plurality of external contacts conductively contacting the plurality of traces.
23. The method as claimed in claim 22 , wherein the step of forming the plurality of external contacts includes plating a third metal layer onto the traces exposed within the openings in the masking layer.
24. The method as claimed in claim 22 , wherein the step of forming the plurality of external contacts includes forming a plurality of metallic bumps.
25. The method as claimed in claim 1 , wherein a step of electrodepositing a second insulative layer includes contacting an exterior surface of the unit with a fluid polymeric composition and applying a current through the fluid composition to electrophoretically deposit the second insulative layer.
26. The method as claimed in claim 25 , wherein the fluid polymeric composition includes a cathodic epoxy composition.
27. The method as claimed in claim 26 , wherein the fluid polymeric composition includes an anodic composition.
28. A method of fabricating a microelectronic unit, the method comprising:
assembling a semiconductor element with a cover element to form a unit, the unit having an exterior major surface parallel to a front face of the semiconductor element, the semiconductor element including a plurality of semiconductor devices, a first insulative layer overlying the front face and a plurality of conductive features overlying the first insulative layer and conductively connected to the plurality of semiconductor devices, at least one of the semiconductor element or the cover element including transverse surfaces extending inwardly from the exterior major surface of the unit, wherein the semiconductor element includes a rear face remote from the front face and the exterior major surface of the unit includes at least a portion of the rear face of the semiconductor element, wherein the semiconductor element includes an imaging area, the unit being assembled with an optical unit having an optical element in registration with the imaging area to form a camera module, the optical element being separated from the semiconductor element by the cover element;
electrodepositing a second insulative layer overlying the transverse surfaces and at least a portion of the exterior major surface; and
forming a plurality of conductive traces overlying the second insulative layer along portions of the transverse surfaces and the exterior major surface, the plurality of conductive traces being connected to the plurality of conductive features.