IP Library › Assignment 030065/0817
Patent Assignment
Reel/Frame 030065/0817

Assignment of Assignor's Interest

Recorded: 2013-03-20 Received: 2013-03-20 Pages: 17
Assignor
Assignee
INVENSAS CORPORATION
2702 ORCHARD PARKWAY, SAN JOSE, CA, USA 95134, UNITED STATES
Covered Properties (23)
Chips Having Rear Contacts Connected by Through Vias to Front Contacts
Application: 13/672,067 →
Semiconductor Packaging Process Using Through Silicon Vias
Application: 13/488,930 →
Chips Having Rear Contacts Connected by Through Vias to Front Contacts
Application: 12/784,841 →
Semiconductor Packaging Process Using Through Silicon Vias
Application: 12/221,204 →
Chips Having Rear Contacts Connected by Through Vias to Front Contacts
Application: 12/072,508 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 11/894,473 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 11/891,867 →
Wafer-Level Fabrication of Lidded Chips with Electrodeposited Dielectric Coating
Application: 11/789,694 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 11/699,852 →
Wafer Level Chip Packaging
Application: 11/655,777 →
Microelectronic Assembly with Multi-Layer Support Structure
Application: 11/650,356 →
Wafer-Level Fabrication of Lidded Chips with Electrodeposited Dielectric Coating
Application: 11/590,616 →
Integrated Circuit Device
Application: 11/588,439 →
Chip Packages with Covers
Application: 11/588,489 →
Integrated circuit device
Application: 11/588,490 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 11/125,624 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 10/884,058 →
Packaged Integrated Circuits and Methods of Producing Thereof
Application: 10/451,564 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 10/462,576 →
Integrated Circuit Device
Application: 10/385,555 →
Methods for Producing Packaged Integrated Circuit Devices and Packaged Integrated Circuit Devices Produced Thereby
Application: 10/277,498 →
Methods for Producing Packaged Integrated Circuit Devices & Packaged Integrated Circuit Devices Produced Thereby
Application: 09/922,770 →
Packaged Integrated Circuits and Methods of Producing Thereof
Application: 09/758,906 →