Packaged integrated circuits and methods of producing thereof
View Patent ↗A packaged integrated circuit and method for producing thereof, including an integrated circuit substrate lying in a substrate plane and having electrical circuitry formed thereon, a package enclosing the integrated circuit substrate and defining first and second planar surfaces generally parallel to the substrate plane and a plurality of electrical contacts, each connected to the electrical circuitry at the substrate plane, at least some of the plurality of electrical contacts extending onto the first planar surface and at least some of the plurality of electrical contacts extending onto the second planar surface.
1. A packaged integrated circuit comprising:
an integrated circuit substrate lying in a substrate plane and having electrical circuitry;
a package enclosing said integrated circuit substrate and defining first and second planar surfaces generally parallel to said substrate plane; and
a plurality of first electrical contacts and a plurality of second electrical contacts, each of said first and second electrical contacts connected to said electrical circuitry at said substrate plane, said plurality of first electrical contacts extending onto said first planar surface but not onto said second planar surface and said plurality of second electrical contacts extending onto said second planar surface, wherein said package includes at least one portion which is at least partially transparent to at least one of visible or infrared radiation.
2. A packaged integrated circuit according to claim 1 , wherein said package is a chip-scale package.
3. A packaged integrated circuit assembly including a packaged integrated circuit as claimed in claim 1 , further comprising:
at least one additional electrical circuit element mounted onto and supported by said second planar surface and electrically coupled to at least one of said plurality of second electrical contacts.
4. A packaged integrated circuit according to claim 3 , wherein said package is a chip-scale package.
5. A packaged integrated circuit assembly according to claim 3 , wherein said at least one additional electrical circuit element comprises an electrical component selected from the group consisting of: passive electrical elements, light generating elements, heat generating elements, light detecting elements, integrated circuits, hybrid circuits, environmental sensors, radiation sensors, micromechanical sensors, mechanical actuators and force sensors.
6. The packaged integrated circuit as claimed in claim 1 , wherein said second electrical contacts do not extend onto said first planar surface.
7. The packaged integrated circuit as claimed in claim 1 , wherein said package further defines first and second oppositely directed edge surfaces, each extending away from said first planar surface, wherein said first electrical contacts extend along at least one of said first and second edge surfaces onto said first planar surface.
8. The packaged integrated circuit as claimed in claim 7 , wherein said package further defines third and fourth oppositely directed edge surfaces, each extending away from said second planar surface, wherein said second electrical contacts extend along at least one of said third and fourth edge surfaces onto said second planar surface.
9. The packaged integrated circuit as claimed in claim 8 , wherein each of said third and fourth edge surfaces is disposed between said first and second edge surfaces.
10. The packaged integrated circuit as claimed in claim 8 , wherein said package further defines fifth and sixth edge surfaces, each disposed between said first and second edge surfaces and extending away from said first planar surface.
11. The packaged integrated circuit as claimed in claim 10 , wherein said fifth and sixth edge surfaces are aligned with a normal to said substrate plane and said third and fourth edge surfaces are not aligned with said normal.
12. The packaged integrated circuit as claimed in claim 10 , wherein said package further defines seventh and eighth edge surfaces, each disposed between said third and fourth edge surfaces and extending away from said second planar surface.
13. The packaged integrated circuit as claimed in claim 10 , wherein said seventh and eighth edge surfaces are aligned with a normal to said substrate plane and said first and second edge surfaces are not aligned with said normal.
14. A method for producing packaged integrated circuits comprising:
providing wafer scale packaging enclosing an integrated circuit substrate, the integrated circuit substrate lying in a substrate plane and having electrical circuitry, the packaging defining first and second planar surfaces generally parallel to said substrate plane;
forming on said wafer scale packaging a plurality of first electrical contacts and a plurality of first and second electrical contacts, each of said plurality of first and second electrical contacts connected to said electrical circuitry at said substrate plane, said plurality of first electrical contacts extending onto said first planar surface but not onto said second planar surface and said plurality of second electrical contacts extending onto said second planar surface; and
separating said wafer scale packaging with said integrated circuit substrate therein into a plurality of individual chip packages, each including an integrated circuit, wherein each of said packages includes at least one portion which is at least partially transparent to at least one of infrared or visible radiation.
15. A method for producing packaged integrated circuits according to claim 14 , wherein said plurality of individual chip packages are chip scale packages.
16. A method for producing packaged integrated circuit assemblies, in accordance with the method claimed in claim 14 , further comprising:
mounting onto said at second planar surface of at least one of said plurality of individual ship packages, at least one additional electrical circuit element, said at least one additional electrical circuit element being supported by said second planar surface and electrically coupled to at least one of said plurality of second electrical contacts.
17. A method of forming a packaged integrated circuit assembly according to claim 16 , wherein said at least one additional electrical circuit element comprises an electrical component selected from the group consisting of: passive electrical elements, light generating elements, heat generating elements, light detecting elements, integrated circuits, hybrid circuits, environmental sensors, radiation sensors, micromechanical sensors, mechanical actuators and force sensors.
18. A method for producing packaged integrated circuits according to claim 16 , wherein said plurality of individual chip packages are chip scale packages.
19. A method for producing packaged integrated circuit assemblies in accordance with the method as claimed in claim 14 , further comprising:
mounting onto said at second planar surface of said wafer scale packaging, at least one additional electrical circuit element, said at least one additional electrical circuit element being supported by said second planar surface and electrically coupled to at least one of said plurality of second electrical contacts.
20. A method of forming a packaged integrated circuit assembly according to claim 19 , wherein said at least one additional electrical circuit element comprises an electrical component selected from the group consisting of: passive electrical elements, light generating elements, heat generating elements, light detecting elements, integrated circuits, hybrid circuits, environmental sensors, radiation sensors, micromechanical sensors, mechanical actuators and force sensors.
21. A method for producing packaged integrated circuits according to claim 19 , wherein said plurality of individual chip packages are chip scale packages.
22. A method for producing packaged integrated circuits according to claim 14 , wherein said second electrical contacts do not extend onto said first planar surface.