IP Library › Assignment 026739/0875
Patent Assignment
Reel/Frame 026739/0875

Change of Name

Recorded: 2011-08-11 Received: 2011-08-11 Pages: 3
Assignor
Assignee
DIGITALOPTICS CORPORATION EUROPE LIMITED
3025 ORCHARD PARKWAY, SAN JOSE, CA, 95134, UNITED STATES
Covered Properties (16)
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 11/894,473 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 11/891,867 →
Wafer-Level Fabrication of Lidded Chips with Electrodeposited Dielectric Coating
Application: 11/789,694 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 11/699,852 →
Wafer Level Chip Packaging
Application: 11/655,777 →
Wafer-Level Fabrication of Lidded Chips with Electrodeposited Dielectric Coating
Application: 11/590,616 →
Integrated Circuit Device
Application: 11/588,439 →
Chip Packages with Covers
Application: 11/588,489 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 11/125,624 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 10/884,058 →
Packaged Integrated Circuits and Methods of Producing Thereof
Application: 10/451,564 →
Methods and Apparatus for Packaging Integrated Circuit Devices
Application: 10/462,576 →
Integrated Circuit Device
Application: 10/385,555 →
Methods for Producing Packaged Integrated Circuit Devices and Packaged Integrated Circuit Devices Produced Thereby
Application: 10/277,498 →
Methods for Producing Packaged Integrated Circuit Devices & Packaged Integrated Circuit Devices Produced Thereby
Application: 09/922,770 →
Packaged Integrated Circuits and Methods of Producing Thereof
Application: 09/758,906 →