Patent Assignment
Reel/Frame 027137/0397
Correction to Reel 026739 Frame 0875 to Correction the Address of Receiving Party.
Recorded: 2011-10-26
Pages: 5
Assignor
TESSERA TECHNOLOGIES IRELAND LIMITED
Executed: 2011-07-13
Assignee
DIGITALOPTICS CORPORATION EUROPE LIMITED
CLIONA, BUILDING ONE, PARKMORE EAST, BUSINESS PARK, BALLYBRIT, GALWAY, IRELAND
Covered Properties
(25)
Methods for Producing Packaged Integrated Circuit Devices and Packagedintegrated Circuit Devices Produced Thereby
Patent:
5,455,455 →
Application:
07/962,222 →
Methods for Producing Intergrated Circuit Devices
Patent:
5,547,906 →
Application:
08/274,251 →
Method and Apparatus for Producing Integrated Circuit Devices
Patent:
5,716,759 →
Application:
08/602,853 →
Methods of Producing Integrated Circuit Devices
Patent:
6,117,707 →
Application:
08/681,598 →
Methods and Apparatus for Producing Integrated Circuit Devices
Patent:
6,040,235 →
Application:
08/682,556 →
Process for Manufacturing Solder Leads on a Semiconductor Device Package
Patent:
6,022,758 →
Application:
08/765,473 →
Bonding Machine
Patent:
5,980,663 →
Application:
08/952,019 →
Integrated Circuit Device
Patent:
6,646,289 →
Application:
09/601,895 →
Methods for Producing Packaged Integrated Circuit Devices & Packaged Integrated Circuit Devices Produced Thereby
Packaged Integrated Circuits and Methods of Producing Thereof
Methods for Producing Packaged Integrated Circuit Devices & Packaged Integrated Circuit Devices Produced Thereby
Methods for Producing Packaged Integrated Circuit Devices and Packaged Integrated Circuit Devices Produced Thereby
Integrated Circuit Device
Packaged Integrated Circuits and Methods of Producing Thereof
Methods and Apparatus for Packaging Integrated Circuit Devices
Methods and Apparatus for Packaging Integrated Circuit Devices
Methods and Apparatus for Packaging Integrated Circuit Devices
Integrated Circuit Device
Chip Packages with Covers
Wafer-Level Fabrication of Lidded Chips with Electrodeposited Dielectric Coating
Wafer Level Chip Packaging
Methods and Apparatus for Packaging Integrated Circuit Devices
Wafer-Level Fabrication of Lidded Chips with Electrodeposited Dielectric Coating
Methods and Apparatus for Packaging Integrated Circuit Devices
Methods and Apparatus for Packaging Integrated Circuit Devices
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 28, 2010
From: SHELLCASE LTD., ALSO SOMETIMES KNOWN AS SHELLCASE, LTD.
To: TESSERA TECHNOLOGIES HUNGARY KFT.
Reel/Frame 024462/0626 →
Assignment of Assignor's Interest
May 28, 2010
From: SHELLCASE LTD., ALSO SOMETIMES KNOWN AS SHELLCASE, LTD.
To: TESSERA TECHNOLOGIES HUNGARY KFT.
Reel/Frame 024461/0412 →
Change of Name
Aug 11, 2011
From: TESSERA TECHNOLOGIES IRELAND LIMITED
To: DIGITALOPTICS CORPORATION EUROPE LIMITED
Reel/Frame 026739/0875 →
Assignment of Assignor's Interest
Mar 20, 2013
From: DIGITALOPTICS CORPORATION EUROPE LIMITED
To: INVENSAS CORPORATION
Reel/Frame 030065/0817 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →