IP Library Assignment 024480/0630
Patent Assignment
Reel/Frame 024480/0630

Assignment of Assignor's Interest

Recorded: 2010-06-03 Pages: 7
Assignors
CHEN, ALAN S.
Executed: 2010-04-27
KOOK, TAEHO
Executed: 2010-04-27
STEINER, KURT G.
Executed: 2010-04-27
NESTON, STEPHEN A.
Executed: 2010-04-27
DANIEL, TIMOTHY J.
Executed: 2010-04-27
Assignee
TRIQUINT SEMICONDUCTOR, INC.
P.O. BOX 609501, ORLANDO, FLORIDA, 32860
Covered Property (1)
Temperature Compensated Surface Acoustic Wave Device and Method Having Buried Interdigital Transducers for Providing an Improved Insertion Loss and Quality Factor
Patent: 8,044,553 →
Application: 12/709,772 →
Publication: US 2011/0204747
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jun 16, 2016
From: TRIQUINT SEMICONDUCTOR, INC.
To: QORVO US, INC.
Reel/Frame 039050/0193 →