Patent Assignment
Reel/Frame 024484/0042
Assignment of Assignor's Interest
Recorded: 2010-06-03
Pages: 4
Assignor
HUANG, HERB HE
Executed: 2010-05-26
Assignee
JIANGSU LEXVU ELECTRONICS CO., LTD.
SUITE 211, NO. 668, JING SHI ER ROAD, ZHENJIANG NEW & HIGH-TECH PARK, ZHENJIANG, JIANGSU 212009, P.R., CHINA
Covered Property
(1)
Method O Encapsulating a Wafer Level Microdevice
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 15, 2011
From: JIANGSU LEXVU ELECTRONICS CO., LTD.
To: SHANGHAI LEXVU OPTO MICROELECTRONICS TECHNOLOGY CO., LTD
Reel/Frame 026139/0854 →
Assignment of Assignor's Interest
Mar 14, 2016
From: SHANGHAI LEXVU OPTO MICROELECTRONICS TECHNOLOGY CO., LTD.
To: XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 037970/0289 →