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Patent Assignment
Reel/Frame 024484/0672

Assignment of Assignor's Interest

Recorded: 2010-06-04 Pages: 4
Assignor
YAMANO, TAKAHARU
Executed: 2010-06-01
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property (1)
Semiconductor Device with Reinforcement Plate and Method of Forming Same
Patent: 8,564,116 →
Application: 12/793,732 →
Publication: US 2010/0320594