Patent Assignment
Reel/Frame 024485/0837
Assignment of Assignor's Interest
Recorded: 2010-06-04
Pages: 5
Assignors
CHO, SUNG-IL
Executed: 2010-05-24
KIM, NAM-GUN
Executed: 2010-05-24
LEE, JONG-CHEOL
Executed: 2010-05-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO,, 442-742, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Semiconductor Device Having Contact Plug