Patent Assignment
Reel/Frame 024493/0115
Assignment of Assignor's Interest
Recorded: 2010-06-07
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Integrated Circuits Including Air Gaps Around Interconnect Structures, and Fabrication Methods Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.