Patent Assignment
Reel/Frame 024513/0557
Assignment of Assignor's Interest
Recorded: 2010-06-01
Pages: 3
Assignors
KIM, YONGHOON
Executed: 2010-05-18
LEE, HEESEOK
Executed: 2010-05-18
CHO, EUNSEOK
Executed: 2010-05-18
KIM, HYUNA
Executed: 2010-05-18
LIM, SOYOUNG
Executed: 2010-05-18
LEE, PALAN
Executed: 2010-05-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including Heat Slugs