Patent Assignment
Reel/Frame 024517/0527
Assignment of Assignor's Interest
Recorded: 2010-06-10
Pages: 3
Assignor
KODANI, KOTARO
Executed: 2010-04-28
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Method of Manufacturing Wiring Substrate