Patent Assignment
Reel/Frame 024518/0479
Assignment of Assignor's Interest
Recorded: 2010-06-10
Pages: 5
Assignees
DONGBU HITEK CO., LTD.
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
KIM, SUNG-JIN
102HO, 50-5, JEONGJA-DONG, JANGAN-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Heat Releasing Semiconductor Package, Method for Manufacturing the Same, and Display Apparatus Including the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.