Patent Assignment
Reel/Frame 024519/0251
Assignment of Assignor's Interest
Recorded: 2010-06-10
Pages: 4
Assignors
SHEN, WEN-WEI
Executed: 2010-05-18
CHEN, CHEN-SHIEN
Executed: 2010-05-18
KUO, CHEN-CHENG
Executed: 2010-05-18
CHEN, MING-FA
Executed: 2010-05-18
WANG, RUNG-DE
Executed: 2010-05-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Strength of Micro-Bump Joints