Patent Assignment
Reel/Frame 024521/0556
Assignment of Assignor's Interest
Recorded: 2010-06-11
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Dummy Wafers in 3DIC Package Assemblies