Patent Assignment
Reel/Frame 024533/0632
Assignment of Assignor's Interest
Recorded: 2010-06-14
Pages: 11
Assignors
TOH, CHIN HOCK
Executed: 2010-05-21
AU, KENG YUEN
Executed: 2010-05-21
STA AGUEDA, REYNALDO VINCENT HERNANDEZ
Executed: 2010-05-21
NG, BEE LIANG CATHERINE
Executed: 2010-05-20
GATBONTON, LIBRADO AMURAO
Executed: 2010-05-20
ZHANG, XUE REN
Executed: 2010-05-21
SUN, YI-SHENG ANTHONY
Executed: 2010-05-12
Assignee
UNITED TEST AND ASSEMBLY CENTER LTD.
5 SERANGOON NORTH AVENUE 5, SINGAPORE, 554916, SINGAPORE
Covered Property
(1)
Semiconductor Package and Method of Packaging Semiconductor Devices
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 1, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0822 →
Corrective Assignment to Correct the to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0822. Assignor(S) Hereby Confirms the Assignment.
Jul 8, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039885/0541 →
Corrective Assignment to Correct the Include Patent Number 8816482 Previously Recorded at Reel: 039885 Frame: 0541. Assignor(S) Hereby Confirms the Assignment.
Sep 25, 2017
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 043979/0820 →