Patent Assignment
Reel/Frame 024540/0812
Assignment of Assignor's Interest
Recorded: 2010-06-15
Pages: 5
Assignors
CHOI, DAESIK
Executed: 2010-06-01
LEE, TAEWOO
Executed: 2010-06-01
LEE, KYUWON
Executed: 2010-06-01
CHO, SUNGWON
Executed: 2010-06-01
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Posts and Method of Manufacture Thereof
Application:
12/791,865 →
Publication:
US 2011/0291264