INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POSTS AND METHOD OF MANUFACTURE THEREOF

1 . A method of manufacture of an integrated circuit packaging system comprising:

providing a semiconductor wafer having a chip pad;

attaching a wafer frame to the semiconductor wafer, the wafer frame having a horizontal cover integral to a protruding connector with the protruding connector on the chip pad;

forming an underfill around the protruding connector and between the horizontal cover and the semiconductor wafer;

removing the horizontal cover exposing the underfill and the protruding connector; and

singulating an integrated circuit package from the semiconductor wafer.

2 . The method as claimed in claim 1 wherein removing the horizontal cover includes planarizing the horizontal cover to expose the protruding connector having planarization marks.

3 . The method as claimed in claim 1 wherein removing the horizontal cover includes etching the horizontal cover to expose the protruding connector having etch marks.

4 . The method as claimed in claim 1 wherein attaching the wafer frame having the horizontal cover integral to the protruding connector includes attaching the wafer frame having a protect layer between the horizontal cover and the protruding connector.

5 . The method as claimed in claim 1 wherein:

attaching the wafer frame having the horizontal cover integral to the protruding connector includes attaching the wafer frame having a protect layer between the horizontal cover and the protruding connector; and

removing the horizontal cover includes exposing the protect layer.

6 . A method of manufacture of an integrated circuit packaging system comprising:

providing a semiconductor wafer having a chip pad;

attaching a wafer frame to the semiconductor wafer, the wafer frame having a horizontal cover integral to a protruding connector with the protruding connector on the chip pad;

applying an underfill around the protruding connector, around the chip pad, and between the horizontal cover and the semiconductor wafer;

removing the horizontal cover exposing the underfill and the protruding connector; and

singulating an integrated circuit package from the semiconductor wafer.

7 . The method as claimed in claim 6 wherein:

attaching the wafer frame having the horizontal cover integral to the protruding connector includes attaching the wafer frame having a protect layer between the horizontal cover and the protruding connector, the protect layer partially within the horizontal cover; and

removing the horizontal cover exposing the protruding connector.

8 . The method as claimed in claim 6 wherein removing the horizontal cover includes planarizing the horizontal cover to expose the underfill having planarization marks.

9 . The method as claimed in claim 6 wherein removing the horizontal cover exposing the underfill includes planarizing the horizontal cover to expose the underfill and the protruding connector having planarization marks.

10 . The method as claimed in claim 6 wherein removing the horizontal cover includes removing the horizontal cover exposing the underfill coplanar with the protruding connector.

11 . An integrated circuit packaging system comprising:

an integrated circuit chip having a chip pad;

a conductive post on the chip pad; and

an underfill around the conductive post, the conductive post exposed from the underfill, and a non-horizontal underfill side of the underfill planar with a non-horizontal side of the integrated circuit chip.

12 . The system as claimed in claim 11 wherein the conductive post includes the conductive post having a post end with planarization marks exposed from the underfill.

13 . The system as claimed in claim 11 wherein the conductive post includes the conductive post having a post end with etch marks exposed from the underfill.

14 . The system as claimed in claim 11 wherein:

the conductive post includes a post end; and

the underfill includes an attachment side planar with the post end, the post end and the attachment side exposed having planarization marks.

15 . The system as claimed in claim 11 wherein the underfill around the conductive post includes the conductive post having a protect layer exposed from the underfill.

16 . The system as claimed in claim 11 wherein the underfill includes the underfill around the chip pad.

17 . The system as claimed in claim 16 wherein:

the underfill includes an attachment side; and

further comprising:

a protect layer on the conductive post exposed above the attachment side.

18 . The system as claimed in claim 16 wherein:

the underfill includes an attachment side; and

the conductive post includes a post end exposed below the attachment side.

19 . The system as claimed in claim 16 wherein:

the underfill includes an attachment side;

the conductive post includes a post end of the conductive post exposed from the attachment side; and

further comprising:

a substrate attached to the post end.

20 . The system as claimed in claim 16 wherein the underfill includes an attachment side of the underfill having etch marks.