Patent Assignment
Reel/Frame 024557/0338
Assignment of Assignor's Interest
Recorded: 2010-06-15
Pages: 2
Assignors
KOMURA, ATSUSHI
Executed: 2010-05-24
KITAMURA, YASUHIRO
Executed: 2010-05-25
AKAGI, NOZOMU
Executed: 2010-05-25
ASAI, YASUTOMI
Executed: 2010-05-24
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Semiconductor Device Including Double-Sided Multi-Electrode Chip Embedded in Multilayer Wiring Substrate