Assignment of Assignor's Interest

Recorded: 2010-06-18 Pages: 6

Assignors

KARPUR, PRASANNA

Executed: 2009-12-22

MUTHUKUMAR, SRIRAM

Executed: 2010-01-04

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052

Covered Property (1)

Methods and Apparatuses to Stiffen Integrated Circuit Package

Patent: 8,143,110 →

Application: 12/646,363 →

Publication: US 2011/0147912