Patent Assignment
Reel/Frame 024565/0725
Assignment of Assignor's Interest
Recorded: 2010-06-21
Pages: 5
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Manufacturing Method of Preparing a Substrate with Forming and Removing the Check Patterns in Scribing Regions Before Dicing to Form Semiconductor Device