Patent Assignment
Reel/Frame 024567/0772
Assignment of Assignor's Interest
Recorded: 2010-06-21
Pages: 3
Assignors
NAKA, YASUHIRO
Executed: 2010-05-24
TANAKA, NAOTAKA
Executed: 2010-06-09
UEMATSU, TOSHIHIDE
Executed: 2010-05-26
MIYAZAKI, CHUICHI
Executed: 2010-05-27
SUZUKI, KAZUNARI
Executed: 2010-05-26
NAKAJIMA, YASUYUKI
Executed: 2010-06-04
ABE, YOSHIYUKI
Executed: 2010-05-26
KOHZU, KENJI
Executed: 2010-06-04
KITAICHI, KOSUKE
Executed: 2010-05-26
OGANE, SHINYA
Executed: 2010-05-31
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device, Semiconductor Wafer and Manufacturing Method of the Same