IP Library › Assignment 024619/0856
Patent Assignment
Reel/Frame 024619/0856

Assignment of Assignor's Interest

Recorded: 2010-06-30 Pages: 4
Assignors
SHIH, YING-CHING
Executed: 2010-06-10
LIN, JING-CHENG
Executed: 2010-06-10
CHIOU, WEN-CHIH
Executed: 2010-06-10
JENG, SHIN-PUU
Executed: 2010-06-22
YU, CHEN-HUA
Executed: 2010-06-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Embedded 3D Interposer Structure
Patent: 8,426,961 →
Application: 12/823,851 →
Publication: US 2011/0316147
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →