Patent Assignment
Reel/Frame 024632/0863
Assignment of Assignor's Interest
Recorded: 2010-07-02
Pages: 8
Assignors
KIM, SHIN-HYE
Executed: 2010-06-23
BYUN, KYUNG-MUN
Executed: 2010-06-23
KIM, HONG-RAE
Executed: 2010-06-23
CHOI, GIL-HEYUN
Executed: 2010-06-23
HONG, EUN-KEE
Executed: 2010-06-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including 3-D Structures with Support Pad Structures and Related Methods and Systems