Patent Assignment
Reel/Frame 024646/0574
Assignment of Assignor's Interest
Recorded: 2010-07-07
Pages: 5
Assignors
JEONG, JAEHUN
Executed: 2010-06-14
LIM, JU-YOUNG
Executed: 2010-06-14
KIM, HANSOO
Executed: 2010-06-14
JANG, JAEHOON
Executed: 2010-06-14
SHIM, SUNIL
Executed: 2010-06-14
SHIM, JAE-JOO
Executed: 2010-06-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Forming the Same