IP Library › Assignment 024647/0724
Patent Assignment
Reel/Frame 024647/0724

Assignment of Assignor's Interest

Recorded: 2010-07-07 Pages: 4
Assignors
CHEN, HUANG-YU
Executed: 2009-09-21
YU, HO CHE
Executed: 2009-09-21
WANG, CHUNG-HSING
Executed: 2009-09-21
CHAO, HSIAO-SHU
Executed: 2009-09-21
CHENG, YI-KAN
Executed: 2009-09-22
LU, LEE-CHUNG
Executed: 2009-09-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Chip-Level Eco Shrink
Patent: 8,418,117 →
Application: 12/831,982 →
Publication: US 2011/0072405