Patent Assignment
Reel/Frame 024649/0853
Assignment of Assignor's Interest
Recorded: 2010-07-08
Pages: 4
Assignors
HWANG, CHIEN LING
Executed: 2010-07-04
HUANG, YING-JUI
Executed: 2010-07-04
LIM, ZHENG-YI
Executed: 2010-07-04
LEI, YI-YANG
Executed: 2010-07-04
LIN, CHENG-CHUNG
Executed: 2010-07-04
LIU, CHUNG-SHI
Executed: 2010-07-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Forming Semiconductor Die