Patent Assignment
Reel/Frame 024655/0231
Assignment of Assignor's Interest
Recorded: 2010-07-08
Pages: 17
Assignors
BARTLEY, GERALD K.
Executed: 2010-06-28
MOTSCHMAN, DAVID R.
Executed: 2010-06-28
SIKKA, KAMAL K.
Executed: 2010-06-24
WAKIL, JAMIL A.
Executed: 2010-06-18
WEI, XIAOJIN
Executed: 2010-06-24
ZHENG, JIANTAO
Executed: 2010-06-22
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Enhanced Thermal Management of 3-D Stacked Die Packaging