Patent Assignment
Reel/Frame 024674/0534
Assignment of Assignor's Interest
Recorded: 2010-07-13
Pages: 4
Assignors
KIM, DONG PYO
Executed: 2010-06-23
BAEK, KYU HA
Executed: 2010-06-23
PARK, KUN SIK
Executed: 2010-06-23
DO, LEE MI
Executed: 2010-06-23
Assignee
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
161 GAJEONG-DONG, YUSEONG-GU, DAEJEON-CITY, 305-700, KOREA, REPUBLIC OF
Covered Property
(1)
Via Forming Method and Method of Manufacturing Multi-Chip Package Using the Same