Patent Assignment
Reel/Frame 024689/0040
Assignment of Assignor's Interest
Recorded: 2010-07-15
Pages: 4
Assignors
CHIU, CHI-TSUNG
Executed: 2010-06-25
OU, YING-TE
Executed: 2010-06-25
WANG, MENG-JEN
Executed: 2010-06-25
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Element Having a Conductive via and Method for Making the Same and Package Having a Semiconductor Element with a Conductive Via