Assignment of Assignor's Interest

Recorded: 2010-07-15 Pages: 3

Assignors

SASAKI, HIDEKI

Executed: 2010-05-25

NISHIKAWA, KENJI

Executed: 2010-05-25

MORIOKA, MUNEHARU

Executed: 2010-05-25

Assignee

RENESAS ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN

Covered Property (1)

Semiconductor package, lead frame, and wiring board with the same

Application: 12/662,811 →

Publication: US 2010/0290202

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.