Assignment of Assignor's Interest

Recorded: 2010-07-19 Pages: 2

Assignor

EGAWA, YOSHIMI

Executed: 2010-06-29

Assignee

OKI SEMICONDUCTOR CO., LTD.

550-1, HIGASHIASAKAWA-CHO, HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN

Covered Property (1)

Semiconductor Package and Package-on-Package Semiconductor Device

Patent: 8,314,492 →

Application: 12/838,910 →

Publication: US 2011/0024904

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.