Patent Assignment
Reel/Frame 024727/0657
Assignment of Assignor's Interest
Recorded: 2010-07-22
Pages: 3
Assignor
KOOK, JOONG-KYO
Executed: 2010-06-25
Assignee
SAMSUNG ELECTRONICS CO., LTD
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Semiconductor Package