Patent Assignment
Reel/Frame 024728/0871
Assignment of Assignor's Interest
Recorded: 2010-07-22
Pages: 3
Assignor
PARK, JIN SEON
Executed: 2010-06-30
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON,, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component-Embedded Printed Circuit Board and Method of Manufacturing the Same