Patent Assignment
Reel/Frame 024729/0112
Assignment of Assignor's Interest
Recorded: 2010-07-22
Pages: 5
Assignors
YANG, CHING-JUNG
Executed: 2010-07-09
HUANG, CHANG-PIN
Executed: 2010-07-09
LIU, TZUAN-HORNG
Executed: 2010-07-09
TONG, MICHAEL SHOU-MING
Executed: 2010-07-09
CHEN, YING-JU
Executed: 2010-07-09
SHAO, TUNG-LIANG
Executed: 2010-07-09
CHEN, HSIEN-WEI
Executed: 2010-07-09
TSAI, HAO-YI
Executed: 2010-07-09
LII, MIRNG-JI
Executed: 2010-07-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Reducing Delamination Between an Underfill and a Buffer Layer in a Bond Structure