IP Library › Assignment 024731/0083
Patent Assignment
Reel/Frame 024731/0083

Merger

Recorded: 2010-07-23 Pages: 3
Assignor
Assignee
UNIMICRON TECHNOLOGY CORPORATION
NO. 38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN
Covered Property (1)
Heat-Conductive Package Structure
Patent: 7,786,571 →
Application: 12/136,316 →
Publication: US 2009/0014865
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 10, 2008
From: CHOU, PAO-HUNG; CHU, CHI-LIANG; WANG, WEI-CHUN
To: PHOENIX PRECISION TECHNOLOGY CORPORATION
Reel/Frame 021072/0370 →