Patent Assignment
Reel/Frame 024735/0012
Assignment of Assignor's Interest
Recorded: 2010-07-23
Pages: 2
Assignor
CHEN, HSIEN-WEI
Executed: 2009-12-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Chip Design with Robust Corner Bumps