Patent Assignment
Reel/Frame 024742/0040
Assignment of Assignor's Interest
Recorded: 2010-07-26
Pages: 4
Assignors
YANG, CHUNG-YING
Executed: 2010-06-28
SHIH, CHAO-WEN
Executed: 2010-06-28
TSAI, HAO-YI
Executed: 2010-06-28
CHEN, HSIEN-WEI
Executed: 2010-06-28
LII, MIRNG-JI
Executed: 2010-07-22
LIU, TZUAN-HORNG
Executed: 2010-06-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Package-on-Package Structures with Reduced Bump Bridging