Patent Assignment
Reel/Frame 024761/0918
Assignment of Assignor's Interest
Recorded: 2010-07-29
Pages: 4
Assignors
CHENG, MING-DA
Executed: 2010-07-25
LU, WEN-HSIUNG
Executed: 2010-07-25
LIN, CHIH-WEI
Executed: 2010-07-25
CHEN, CHING-WEN
Executed: 2010-07-26
WU, YI-WEN
Executed: 2010-07-26
CHANG, CHIA-TUNG
Executed: 2010-07-26
HO, MING-CHE
Executed: 2010-07-26
LIU, CHUNG-SHI
Executed: 2010-07-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Mechanisms for Forming Copper Pillar Bumps