Patent Assignment
Reel/Frame 024778/0666
Assignment of Assignor's Interest
Recorded: 2010-07-28
Pages: 4
Assignors
MUNEKATA, OSAMU
Executed: 2010-06-22
TOYODA, YOSHITAKA
Executed: 2010-05-07
OHNISHI, TSUKASA
Executed: 2010-05-09
UESHIMA, MINORU
Executed: 2010-05-31
Assignee
SENJU METAL INDUSTRY CO., LTD.
23 SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO 120-8555, JAPAN
Covered Property
(1)
Lead-Free Solder Alloy