IP Library Assignment 024832/0875
Patent Assignment
Reel/Frame 024832/0875

Assignment of Assignor's Interest

Recorded: 2010-08-13 Pages: 3
Assignors
MAEKAWA, SHINJI
Executed: 2010-07-14
SUZUKI, MIYUKI
Executed: 2010-07-14
Assignee
DAI NIPPON PRINTING CO., LTD.
1-1-1, ICHIGAYA-KAGACHO, SHINJUKU-KU, TOKYO, 162-8001, JAPAN
Covered Property (1)
Through Hole Electrode Substrate with Different Area Weighted Average Crystal Grain Diameter of Metal in the Conductive Part and Semiconductor Device Using the Through Hole Electrode Substrate
Patent: 8,288,772 →
Application: 12/855,266 →
Publication: US 2011/0062594