IP Library Assignment 024834/0118
Patent Assignment
Reel/Frame 024834/0118

Assignment of Assignor's Interest

Recorded: 2010-08-13 Pages: 2
Assignors
SASAKI, TAKAFUMI
Executed: 2010-07-05
NAKASHIMA, SADAO
Executed: 2010-07-07
IMAI, YOSHINORI
Executed: 2010-07-05
KURIBAYASHI, KOEI
Executed: 2010-07-05
Assignee
HITACHI KOKUSAI ELECTRIC, INC.
14-1 SOTOKANDA 4-CHOME, CHIYODA-KU,, TOKYO, 1018980, JAPAN
Covered Property (1)
Substrate Processing Apparatus , Method of Manufacturing Semiconductor Device, and Method of Manufacturing Substrate
Patent: 8,450,220 →
Application: 12/825,005 →
Publication: US 2010/0330781
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 26, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047620/0001 →