Patent Assignment
Reel/Frame 024834/0819
Assignment of Assignor's Interest
Recorded: 2010-08-11
Pages: 10
Assignors
KAWAMATA, YUJI
Executed: 2010-06-30
UESHIMA, MINORU
Executed: 2010-06-08
TAMURA, TOMU
Executed: 2010-07-08
MATSUSHITA, KAZUHIRO
Executed: 2010-07-09
SAKAMOTO, MASASHI
Executed: 2010-07-08
Assignee
SENJU METAL INDUSTRY CO., LTD.
23 SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO 120-8555, JAPAN
Covered Property
(1)
Indium-Containing Lead-Free Solder for Vehicle-Mounted Electronic Circuits